Characterization of Equalized and Repeated Interconnects for NoC Applications

  • Authors:
  • Byungsub Kim;Vladimir Stojanović

  • Affiliations:
  • Massachusetts Institute of Technology;Massachusetts Institute of Technology

  • Venue:
  • IEEE Design & Test
  • Year:
  • 2008

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Abstract

Editor's note:As the number of cores increases and on- and off-chip bandwidth demand rises, it is becoming increasingly more difficult to rely on conventional interconnects and remain within the chip power budget. This article explores leveraging equalization for global and semi-global long interconnects to overcome this problem.—Li-Shiuan Peh, Princeton University