Efficient Estimation of Die-Level Process Parameter Variations via the EM-Algorithm

  • Authors:
  • Amir Zjajo;Shaji Krishnan;Jose Pineda de Gyvez

  • Affiliations:
  • NXP Semiconductors Research, High Tech Campus 37, 5656 AE Eindhoven, The Netherlands, e-mail: amir.zjajo@nxp.com;NXP Semiconductors Research, High Tech Campus 37, 5656 AE Eindhoven, The Netherlands;NXP Semiconductors Research, High Tech Campus 37, 5656 AE Eindhoven, The Netherlands, Eindhoven University of Technology, Den Dolech 2, 5612 AZ Eindhoven, The Netherlands

  • Venue:
  • DDECS '08 Proceedings of the 2008 11th IEEE Workshop on Design and Diagnostics of Electronic Circuits and Systems
  • Year:
  • 2008

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Abstract

A new approach for efficient estimation of die-level process parameter variations based on the expectation- maximization algorithm is proposed. To estimate the parameters and enhance diagnostic analysis, dedicated embedded sensors have been designed. Additionally, to guide the test with the information obtained through monitoring process variations, maximum-likelihood method and adjusted support vector machine classifier is employed. The information acquired is re-used and supplement the circuit calibration. The proposed estimation method is evaluated on a prototype ADC converter with dedicated sensors fabricated in standard single poly, five metal 0.09-mum CMOS.