Thermal-Assisted Spin Transfer Torque Memory (STT-RAM) Cell Design Exploration

  • Authors:
  • Hai Li;Haiwen Xi;Yiran Chen;John Stricklin;Xiaobin Wang;Tong Zhang

  • Affiliations:
  • -;-;-;-;-;-

  • Venue:
  • ISVLSI '09 Proceedings of the 2009 IEEE Computer Society Annual Symposium on VLSI
  • Year:
  • 2009

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Abstract

Thermal-assisted spin-transfer torque random access memory (STT-RAM) has been considered as a promising candidate of next-generation nonvolatile memory technology. We conducted finite element simulation on thermal dynamics in the programming process of thermal-assisted STT-RAM. Special attentions have been paid to the scalability and design space of the thermal-assist programming scheme by varying the memory element dimension and resistance-area product. We also provide systematic analysis and comparison between the thermal-assisted STT-RAM and standard STT-RAM. Discussions on the writeability and scalability of thermal-assisted STT-RAM are also conducted.