Benchmarking for research in power delivery networks of three-dimensional integrated circuits
Proceedings of the 2013 ACM international symposium on International symposium on physical design
TSV redundancy: architecture and design issues in 3-D IC
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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Editor's note:This article studies one of the EDA problems for 3D IC design. The article presents a design automation solution for power grid optimization in 3D ICs. The authors propose a congestion-aware 3D power supply network optimization algorithm, which applies a sequence-of-linear-programs–based method to optimize the power grid design.—Yuan Xie, Pennsylvania State University