Digital image processing (2nd ed.)
Digital image processing (2nd ed.)
Face Detection in Color Images
IEEE Transactions on Pattern Analysis and Machine Intelligence
Neural Networks: A Comprehensive Foundation
Neural Networks: A Comprehensive Foundation
Computer and Robot Vision
Simulation studies of two-layer hopfield neural networks for automatic wafer defect inspection
IEA/AIE'06 Proceedings of the 19th international conference on Advances in Applied Artificial Intelligence: industrial, Engineering and Other Applications of Applied Intelligent Systems
Password Authentication Using Hopfield Neural Networks
IEEE Transactions on Systems, Man, and Cybernetics, Part C: Applications and Reviews
IEEE Transactions on Systems, Man, and Cybernetics, Part B: Cybernetics
Automatic die inspection for post-sawing LED wafers
SMC'09 Proceedings of the 2009 IEEE international conference on Systems, Man and Cybernetics
Engineering Applications of Artificial Intelligence
Novelty detection for the inspection of light-emitting diodes
Expert Systems with Applications: An International Journal
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A system for the automatic inspection of LED wafer defects is proposed to detect defective dies in a four-element (aluminum gallium indium phosphide, AlGaInP) wafer. There are over 80000 dies on an LED wafer. Defective dies are typically visually identified with the aid of a scanning electron microscope. This process involves dozens of operators or engineers visually checking the wafers and hand marking the defective dies. However, wafers may not be fully and thoughtfully checked, and different observers usually find different results. These shortcomings lead to significant labor and production costs. Therefore, a solution that consists of two Hopfield neural networks, of which one is used to identify the LED die regions and the other is used to cluster the die into three groups, is proposed to facilitate the detection of defective dies in wafer images. The experimental results show that the proposed method successfully detects defective dies in a four-element wafer.