Automatic die inspection for post-sawing LED wafers

Authors:
Chuan-Yu Chang;Chun-Hsi Li;Yung-Chi Chang;MuDer Jeng
Affiliations:
Department of Computer Science and Information Engineering, National Yunlin University of Science & Technology, Douliou, Taiwan;Department of Electrical Engineering, National Taiwan Ocean University, Keelung, Taiwan;Department of Computer Science and Information Engineering, National Yunlin University of Science & Technology, Douliou, Taiwan;Department of Electrical Engineering, National Taiwan Ocean University, Keelung, Taiwan
Venue:
SMC'09 Proceedings of the 2009 IEEE international conference on Systems, Man and Cybernetics
Year:
2009

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Abstract

Wafer defect inspection is an important process that is performed before die packaging. Conventional wafer inspections are usually performed using human visual judgment. A large number of people visually inspect wafers and hand-mark the defective regions. This requires considerable personnel resources and misjudgment may be introduced due to human fatigue. In order to overcome these shortcomings, this study develops an automatic inspection system that can recognize defective LED dies. An artificial neural network is adopted in the inspection. Actual data obtained from a semiconductor manufacturing company in Taiwan were used in the experiments. The results show that the proposed approach successfully identified the defective dies on LED wafers. Personnel costs and misjudgment due to human fatigue can be reduced using the proposed approach.