Automatic Solder Joint Inspection
IEEE Transactions on Pattern Analysis and Machine Intelligence
A Tiered-Color Illumination Approach for Machine Inspection of Solder Joints
IEEE Transactions on Pattern Analysis and Machine Intelligence - Special Issue on Industrial Machine Vision and Computer Vision Technology:8MPart
Computer Vision: A Modern Approach
Computer Vision: A Modern Approach
Inspection of surface defects in copper strip using multivariate statistical approach and SVM
International Journal of Computer Applications in Technology
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This paper presents an illuminator for the Automatic Optical Inspection (AOI) system. First, the structure of the designed illuminator is introduced. The structure consists of three Light Emitting Diode (LED) arrays, which have different colour and radiation angles. Second, the radiance model of the illuminator and the irradiance model of the solder joint are developed. Third, the dimensions of the illuminator are optimised based on the irradiance model. Finally, the inspection method is implemented and tested, and experimental results verify the validity of the design.