Future of interconnect fabric: a contrarian view

Authors:
Shekhar Borkar
Affiliations:
Intel Corp., Hillsboro, OR, USA
Venue:
Proceedings of the 12th ACM/IEEE international workshop on System level interconnect prediction
Year:
2010

Citing 2
Cited 0

Warp: an integrated solution of high-speed parallel computing

Proceedings of the 1988 ACM/IEEE conference on Supercomputing
Route packets, not wires: on-chip inteconnection networks

Proceedings of the 38th annual Design Automation Conference

Quantified Score

Hi-index	0.00

Visualization

Abstract

This paper discusses the state of the art in the interconnect fabric, identifies energy as the primary barrier in the future, and provides possible solutions.