Multilevel finite difference methods for the characterization of substrate coupling in deep sub-micron designs

  • Authors:
  • L. Miguel Silveira;Nuno Vargas

  • Affiliations:
  • INESC, Cadence European Laboratories, Dept. of Electrical and Comp. Engineering, Instituto Superior Técnico, Technical University of Lisbon, Lisboa, Portugal;INESC, Cadence European Laboratories, Dept. of Electrical and Comp. Engineering, Instituto Superior Técnico, Technical University of Lisbon, Lisboa, Portugal

  • Venue:
  • SBCCI'99 Proceedings of the XIIth conference on Integrated circuits and systems design
  • Year:
  • 1999

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Abstract

Accurate modeling of noise coupling effects due to crosstalk via the substrate is an increasingly important concern for the design and verification of analog, digital and mixed analog-digital systems. In this paper we present a technique for model characterization that is based on a finite difference formulation whose solution is accelerated by means of a multilevel method. This technique can be used for accurate and efficient extraction of substrate coupling parameters in deep sub-micron designs.