Full length Article: Assembly simulations in virtual environments with optimized haptic path and sequence

Authors:
Christiand;Jungwon Yoon
Affiliations:
School of Mechanical and Aerospace Engineering and ReCAPT, Gyeongsang National University, Jinju, Republic of Korea;School of Mechanical and Aerospace Engineering and ReCAPT, Gyeongsang National University, Jinju, Republic of Korea
Venue:
Robotics and Computer-Integrated Manufacturing
Year:
2011

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Abstract

Virtual assembly and disassembly simulations can be accomplished in intuitive and effective ways using haptic information in virtual environments (VEs). Potential problems in a given assembly scheme can be predicted by a user who may be able to suggest an alternative scheme in the VE. This paper describes an intelligent virtual assembly system in which an optimal assembly algorithm is used to allow haptic interactions during virtual assembly operations. This algorithm provides optimal paths for haptic guidance as well as an assembly sequence of the parts to be assembled. The performance of the given assembly schemes was simulated using a virtual assembly system. Experimental results showed that the haptic-path sequence-guidance (HSG) mode gave the best performance improvement in terms of accumulated assembly time (28.33%) and travel distance (15.05%) compared to the unguided mode, while the sequence-guidance (SG) mode alone increased performance by 15.33% for assembly time and 11.36% for travel distance. The experimental results were analyzed by the sub-tasks of gripper selection, inter-part movement, and part assembly. For the HSG mode, the greatest contributor to the time and distance reductions was the optimized haptic path, while for the SG mode, the reduced numbers of gripper exchanges and orientation change made the greatest contributions to reducing the assembly time and the travel distance. As a result, the optimized haptic path, as well as sequence guidance, enhanced the working performance of virtual assembly tasks.