Environmental stress testing with boundary-scan

  • Authors:

  • Duy Le;Ivan Karolilk;Ronald Smith;A. J. Mcgovern;Chyral Curette;Joseph Ulbin;Michael Zarubaiko;Charles Henry;Lewis Stevens

  • Affiliations:

  • AT&T Bell Laboratories, Engineering Research Center, Princeton, NJ;AT&T Bell Laboratories, Engineering Research Center, Princeton, NJ;AT&T Network Systems, North Andove, MA;AT&T Network Systems, North Andove, MA;AT&T Network Systems, North Andove, MA;AT&T Network Systems, North Andove, MA;AT&T Network Systems, North Andove, MA;AT&T Network Systems, North Andove, MA;AT&T Network Systems, North Andove, MA

  • Venue:
  • ITC'94 Proceedings of the 1994 international conference on Test
  • Year:
  • 1994

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Abstract

Environmental Stress Testing (EST) enhances product quality and reliability by detecting latent or marginal defects in a product. For EST to be effective, testing of a product must achieve a high fault coverage so that as many EST-induced defects can be detected. By utilizing Boundary-Scan (IEEE Std 1149.1-1990 [1]), EST can achieve a high fault coverage and at the same time, minimize test cost. The paper describes a complete infrastructure, both software and hardware, for using Boundary-Scan (BS) in EST. In addition, the paper shows a simplified control mechanism to select individual circuit packs for Boundary-Scan testing. This control mechanism minimizes the number of wires required to drive the control interface and thus, the number of wires in the cable that connects a tester to the backplane of a system under test and across which Boundary-Scan tests are executed. Finally, the paper presents and discusses some study results for evaluating the effectiveness of monitored EST.