Fine bookbinding meets electronics

Authors:
Daniela K. Rosner;Hannah Perner-Wilson;Jie Qi;Leah Buechley
Affiliations:
University of California, Berkeley , Berkeley, CA, USA;Massachusetts Institute of Technology, Cambridge, MA, USA;Massachusetts Institute of Technology, Cambridge, MA, USA;Massachusetts Institute of Technology, Cambridge, MA, USA
Venue:
Proceedings of the fifth international conference on Tangible, embedded, and embodied interaction
Year:
2010

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Abstract

As technologies, finely bound books are compact, durable forms that get passed from one generation to the next. As handcrafted objects, they exemplify manual control and dexterity, patience and care, and continuity with the past. Paper-based electronic books, by contrast, are relatively new objects that enable novel interactions with material. Here we explore connections between centuries-old and contemporary building techniques by adding electronics to traditional binding. What kinds of details would be interesting to learn about the past? How could we use conductive fibers to talk to the future? What could gilded edges tell us about our interactions with books? In this studio, participants will build basic bookbinding and e-textiles skills to enable new material explorations.