A method to leverage pre-silicon collateral and analysis for post-silicon testing and validation

  • Authors:
  • Gary Miller;Bandana Bhattarai;Yu-Chin Hsu;Jay Dutt;Xi Chen;George Bakewell

  • Affiliations:
  • Freescale Semiconductor Inc., Austin, TX;Freescale Semiconductor Inc., Austin, TX;SpringSoft Inc., San Jose, CA;SpringSoft Inc., San Jose, CA;SpringSoft Inc., San Jose, CA;SpringSoft Inc., San Jose, CA

  • Venue:
  • Proceedings of the 48th Design Automation Conference
  • Year:
  • 2011

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Abstract

Post-silicon testing and validation -- whether to screen out defective parts, confirm proper operation in the target application, or test robustness in the presence of transient issues induced by environmental factors -- is especially crucial for safety-critical devices. These activities sometimes leverage information gathered prior to fabrication through the injection and testing of stuck-at and transient faults. Traditionally, this process requires a gate-level model in which faulty logic nodes are modeled as 0 and 1 either statically or dynamically. Operating on this unfamiliar gate-level model is a laborious task for engineering teams, requiring a significant investment in time and compute power. This complicates the tasks of better equipping designs for safety-critical needs and augmenting production test quality metrics using well-chosen functional tests. This paper presents research into new techniques for speeding up this process using RTL models and RTL simulation.