Detection of soldering defects in Printed Circuit Boards with Hierarchical Marked Point Processes

Authors:
Csaba Benedek
Affiliations:
Distributed Events Analysis Research Group, Computer and Automation Institute, Kende u. 13-17, Budapest, Hungary and Department of Electronics Technology, Budapest University of Technology and Eco ...
Venue:
Pattern Recognition Letters
Year:
2011

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Abstract

In this paper we introduce a probabilistic approach for optical quality checking of solder pastes (SP) in Printed Circuit Boards (PCB). Dealing with unregistered image inputs, our task is to address at the same time SP identification, and detection of special soldering errors, called scooping. For this reason we introduce a novel Hierarchical Marked Point Process (HMPP) framework, which is able to handle the paste and scooping extraction problems simultaneously, so that the SPs and included scoops have a parent-child relationship. A global optimization process attempts to find the optimal configuration of entities, considering the observed data, prior knowledge, and interactions between the neighboring circuit elements. The proposed method is evaluated on a real PCB image set containing more than 3000 SPs and 600 scooping artifacts. A morphology-based baseline method is also introduced for the problem and used as reference for qualitative and quantitative comparison against the proposed model.