Graph bipartization and via minimization
SIAM Journal on Discrete Mathematics
Facets of the balanced (acyclic) induced subgraph polytope
Mathematical Programming: Series A and B
Compositions in the bipartite subgraph polytope
Discrete Mathematics
Compositions of Graphs and Polyhedra I: Balanced Induced Subgraphs and Acyclic Subgraphs
SIAM Journal on Discrete Mathematics
Wheel inequalities for stable set polytopes
Mathematical Programming: Series A and B
A characterization of weakly bipartite graphs
Journal of Combinatorial Theory Series B
SNPs Problems, Complexity, and Algorithms
ESA '01 Proceedings of the 9th Annual European Symposium on Algorithms
Wire routing by optimizing channel assignment within large apertures
DAC '71 Proceedings of the 8th Design Automation Workshop
The Haplotyping problem: an overview of computational models and solutions
Journal of Computer Science and Technology
Polyhedral results for the bipartite induced subgraph problem
Discrete Applied Mathematics - Special issue: International symposium on combinatorial optimization CO'02
An efficient approach to multilayer layer assignment with an application to via minimization
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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In this paper we consider the 2-layer constrained via minimization problem and the SNP haplotype assembly problem. The former problem arises in the design of integrated and printed circuit boards, and the latter comes up in the DNA sequencing process for diploid organisms. We show that, for any maximum junction degree, the problem can be reduced to the maximum bipartite induced subgraph problem. Moreover we show that the SNP haplotype assembly problem can also be reduced to the maximum bipartite induced subgraph problem for the so-called minimum error correction criterion. We give a partial characterization of the bipartite induced subgraph polytope. Using this, we devise a branch-and-cut algorithm and report some experimental results. This algorithm has been used to solve real and large instances.