Predictability for timing and temperature in multiprocessor system-on-chip platforms
ACM Transactions on Embedded Computing Systems (TECS) - Special section on ESTIMedia'12, LCTES'11, rigorous embedded systems design, and multiprocessor system-on-chip for cyber-physical systems
Thermal analysis of periodic real-time systems with stochastic properties: an analytical approach
Proceedings of the 21st International conference on Real-Time Networks and Systems
Journal of Electronic Testing: Theory and Applications
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Due to increased on-chip power density, multi-core systems face various thermal issues. In particular, exceeding a certain threshold temperature can reduce the system's performance and reliability. Therefore, when designing a real-time application with non-deterministic workload, the designer has to be aware of the maximum possible temperature of the system. This paper proposes an analytic method to calculate an upper bound on the worst-case peak temperature of a real-time system with multiple cores generated under all possible scenarios of task executions. In order to handle a broad range of uncertainties, task arrivals are modeled as periodic event streams with jitter and delay. Finally, the proposed method is applied to a multi-core ARM platform and our results are validated in various case studies.