Co-optimization of TSV assignment and micro-channel placement for 3D-ICs

Authors:
Bing Shi;Caleb Serafy;Ankur Srivastava
Affiliations:
University of Maryland, College Park, MD, USA;University of Maryland, College Park, MD, USA;University of Maryland, College Park, MD, USA
Venue:
Proceedings of the 23rd ACM international conference on Great lakes symposium on VLSI
Year:
2013

Citing 3
Cited 0

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An integrated algorithm for 3D-IC TSV assignment

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Non-uniform micro-channel design for stacked 3D-ICs

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Abstract

The three dimensional circuit (3D-IC) brings forth new challenges to physical design such as allocation and management of through-silicon-vias (TSVs). Meanwhile, the thermal issues in 3D-IC becomes significant necessitating the use of active cooling schemes such as micro-channel liquid coolings. Both TSVs and micro-channels go through the interlayer regions of 3D-IC resulting in potential resource conflict. This paper investigates the co-optimization of TSV assignment to interlayer nets and micro-channel allocation such that both wirelength and micro-channel cooling energy are co-optimized. We propose a multi-commodity flow based formulation to solve the co-optimization. The experimental results show that, our approach achieves 51% cooling power savings or 6.08% wire length reduction compared with the approaches that assign TSVs and allocate micro-channels separately.