Network flows: theory, algorithms, and applications
Network flows: theory, algorithms, and applications
The Stanford GraphBase: a platform for combinatorial computing
The Stanford GraphBase: a platform for combinatorial computing
Computers and Intractability: A Guide to the Theory of NP-Completeness
Computers and Intractability: A Guide to the Theory of NP-Completeness
Introduction to Algorithms
Assignment Problems
A study of Through-Silicon-Via impact on the 3D stacked IC layout
Proceedings of the 2009 International Conference on Computer-Aided Design
Global routing by new approximation algorithms for multicommodity flow
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Co-optimization of TSV assignment and micro-channel placement for 3D-ICs
Proceedings of the 23rd ACM international conference on Great lakes symposium on VLSI
Multiple chip planning for chip-interposer codesign
Proceedings of the 50th Annual Design Automation Conference
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Through-Silicon Via (TSV) is a technology that enables vertical integration of silicon dies forming a single 3D-IC stack. In this paper, a practical model is proposed for the TSV assignment problem of the stacked-die 3D nets. We present the first work in the literature to prove that the general 3D-IC TSV assignment problem with more than two dies is NP-complete. An efficient heuristic algorithm that combines Shortest Path, Bipartite Matching, Min-cost Max-flow and Integer Linear Programming is developed. Experimental results demonstrate that our flow achieves good quality of results (within 98% of the optimal solution) with reasonable run-time compared to related works.