An interconnect model for arbitrary terminations based on scattering parameters
Analog Integrated Circuits and Signal Processing - Special issue on high-speed interconnects
Efficient linear circuit analysis by Pade approximation via the Lanczos process
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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An approach is presented for modeling board level, package-level, and MCM substrate-level interconnect circuitry based an measured time domain refectometry data. The time-domain scattering parameters of a multiport system are used to extract a SPICE netlist which uses standard elements to match the behavior of the device up to a user-specified cutoff frequency. Linear or nonlinear circuits may be connected to the model ports, and the entire circuit simulated in a standard circuit simulator. Two-port and four-port example microstrip circuits are characterized, and the simulation results are compared with measured data. Delay, reflection transmission, and crosstalk are accurately modeled in each case.