A unified approach to simulating electrical and thermal substrate coupling interactions in ICs

• Authors:

• Nishath K. Verghese;Sang-Soo Lee;David J. Allstot

• Affiliations:

• Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh, PA;Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh, PA;Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh, PA

• Venue:
• ICCAD '93 Proceedings of the 1993 IEEE/ACM international conference on Computer-aided design
• Year:
• 1993