A Dependable High Performance Wafer Scale Architecture for Embedded Signal Processing

  • Authors:
  • Richard W. Linderman;Ralph L. R. Kohler;Mark H. Linderman

  • Affiliations:
  • US Air Force Research Lab, Rome, NY;US Air Force Research Lab, Rome, NY;US Air Force Research Lab, Rome, NY

  • Venue:
  • IEEE Transactions on Computers
  • Year:
  • 1998

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Abstract

A high performance, programmable, floating point multiprocessor architecture has been specifically designed to exploit advanced two- and three-dimensional hybrid wafer scale packaging to achieve low size, weight, and power, and improve reliability for embedded systems applications. Processing elements comprised of a 0.8 micron CMOS dual processor chip and commercial synchronous SRAMs achieve more than 100 MFLOPS/Watt. This power efficiency allows up to 32 processing elements to be incorporated into a single 3D multichip module, eliminating multiple discrete packages and thousands of wirebonds. The dual processor chip can dynamically switch between independent processing, watchdog checking, and coprocessing modes. A flat, SRAM memory provides predictable instruction set timing and independent and accurate performance prediction