Interconnect in high speed designs: problems, methodologies and tools

Authors:
Phillip J. Restle;Joel Phillips;Ibrahim Elfadel
Affiliations:
IBM Corp., T. J. Watson Research Center, Yorktown Heights, NY;Cadence Design Systems, San Jose, CA;IBM Corp., T. J. Watson Research Center, Yorktown Heights, NY
Venue:
Proceedings of the 1998 IEEE/ACM international conference on Computer-aided design
Year:
1998

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Abstract