Understanding the impact of equipment and process changes with a heterogeneous semiconductor manufacturing simulation environment

Authors:
Jeffrey W. Herrmann;Brian F. Conaghan;Laurent Henn-Lecordier;Praveen Mellacheruvu;Manh-Quan Nguyen;Gary W. Rubloff;Rock Z. Shi
Affiliations:
University of Maryland, College Park, MD;University of Maryland, College Park, MD;University of Maryland, College Park, MD;University of Maryland, College Park, MD;University of Maryland, College Park, MD;University of Maryland, College Park, MD;University of Maryland, College Park, MD
Venue:
Proceedings of the 32nd conference on Winter simulation
Year:
2000

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Abstract

Simulation models are useful to predict and understand the impact of changes to a manufacturing system. Typical factory simulation models include the parts being manufactured in the factory and the people and resources processing and handling the parts. However, these models do not include equipment or process details, which can affect operational performance such as cycle time and inventory. Separate models are used to evaluate processes and equipment. Thus, it is difficult to evaluate the operational impact of equipment or process changes. However, this information could help factory managers and manufacturing process engineers make better decisions when changing processes or selecting equipment configurations. This paper describes a heterogeneous simulation environment for understanding how equipment and process changes affect the performance of a wafer fabrication facility. This integrated tool incorporates response surface models that describe process behavior, operational and optimization models of equipment behavior, and a discrete-event simulation model of factory operations. Thus, the tool can measure how process changes and equipment configuration changes change the system performance. We have applied this tool to a specific wafer fab problem.