Testing a multichip package for a consumer communications application

Authors:
Alex S. Biewenga;Math Muris;Rodger Schuttert;Urs Fawer
Affiliations:
-;-;-;-
Venue:
ITC '98 Proceedings of the 1998 IEEE International Test Conference
Year:
1998

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Abstract

A multichip package was developed to meet the marketrequirements for an advanced wireless telephone handset.The successful testing process of this multichip package,comprising test requirements, test strategy, testdevelopment and results from the production test ispresented. A wireless telephone handset, containing themultichip package is currently in high volume productionwithin Philips.