Strained-si devices and circuits for low-power applications

  • Authors:
  • Keunwoo Kim;Rajiv V. Joshi;Ching-Te Chuang

  • Affiliations:
  • IBM T. J. Watson Research Center, Yorktown Heights, NY;IBM T. J. Watson Research Center, Yorktown Heights, NY;IBM T. J. Watson Research Center, Yorktown Heights, NY

  • Venue:
  • Proceedings of the 2003 international symposium on Low power electronics and design
  • Year:
  • 2003

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Abstract

Static and dynamic power for strained-Si device is analyzed and compared with conventional bulk-Si technology. Optimum device design points are suggested with controlling physical/structural device parameters. Strained-Si CMOS circuits are studied, showing substantially-reduced power consumptions due to unique advantageous features of strained-Si device. The trade-offs for power and performance in strained-Si devices/circuits are discussed. Further, analysis and low-power design points are applied and extended to strained Si on SOI substrate (SSOI) CMOS technology.