Exploiting parallelism in pattern matching: an information retrieval application
ACM Transactions on Information Systems (TOIS)
A Novel Discrete Relaxation Architecture
IEEE Transactions on Pattern Analysis and Machine Intelligence
A case for Wafer-scale interconnected memory arrays
Proceedings of the 1992 ACM/IEEE conference on Supercomputing
Trends in Silicon-On-Silicon Multichip Modules
IEEE Design & Test
VLSI Accelerators for Large Database Systems
IEEE Micro
Programmable Multichip Modules
IEEE Micro
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Multichip modules (MCMs), which interconnect multiple bare dice by means of a stack of conductive and dielectric thin films, are discussed. Among their advantages are reduced delays between chips, simplified power distribution, and enhanced dissipation capabilities. Key design demands that should be weighed by IC design engineers planning to use MCMs are examined. They concern transmission delays, power distribution, heat dissipation, and temperature, as well as testing, burn-in, and rework. The various approaches to MCM packages are described. Factory-programmable versus user-programmable options are considered. Techniques for connecting chips to substrates are discussed