On The Yield of Compiler-Based eSRAMs

  • Authors:
  • X. Wang;M. Ottavi;F. Meyer;F. Lombardi

  • Affiliations:
  • IBM Corp, Essex Junction (VT) USA;Northeastern University Boston (MA) USA;Wichita State University Wichita (KS) USA;Northeastern University Boston (MA) USA

  • Venue:
  • DFT '04 Proceedings of the Defect and Fault Tolerance in VLSI Systems, 19th IEEE International Symposium
  • Year:
  • 2004

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Abstract

This paper presents an extensive evaluation of the manufacturing yield of embedded SRAMs (eSRAM) which are designed using a memory compiler. The yield is evaluated by considering the different design constructs (generally referred to as kernels) that are used in defining the memory architecture through a compiler. Architectural considerations such as array size and line (word and bit) organization are analyzed. Compiler-based features of different kernels(such as required for decoding) are also treated in detail. An extensive evaluation of the provided redundancy (row, column and combined) is pursued to characterize its impact on the memory yield. Industrial data is used in the evaluation and an industrial ASIC chip (made of multiple eSRAMs) is also considered as design case.