Microsystem design
RF MEMS: Theory, Design, and Technology
RF MEMS: Theory, Design, and Technology
Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process
DTIP '03 Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Young's modulus and residual stress of DF PECVD silicon nitride for MEMS free-standing membranes
Microelectronic Engineering
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In this article materials issues that arise during the processing and operation of micro-electro mechanical systems devices (MEMS), and their impact on the functionality and reliability, are discussed. The article starts with the example of an RF-MEMS switch process flow, indicating how and why certain materials are chosen. Then two specific MEMS materials issues, e.g. stiction and stress, are covered. Finally, the so-called 'zero-level' packaging of MEMS as well as the effect packaging can have on the device and its operation will be reviewed.