Effects of inductance on the propagation delay and repeater insertion in VLSI circuits
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Inductance Aware Interconnect Scaling
ISQED '02 Proceedings of the 3rd International Symposium on Quality Electronic Design
Modeling skin and proximity effects with reduced realizable RL circuits
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Impact of on-chip interconnect frequency-dependent R(f)L(f) on digital and RF design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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Since the skin effect will increase the propagation delay in an interconnect, it will also affect how to optimally select the number and size of the buffers. Failing to include the skin effect during buffer design may result in as much as 35% extra delay compared to the optimal repeater chain. We present a new method with closed-form expressions for repeater insertion where we take into account the skin effect and also the relationship between interconnect resistance, capacitance and inductance that are determined from the geometrical parameters. We also investigate the skin-effect influence on power dissipation for an optimally designed repeater chain, and find that the increase is at most 10% of the dynamic power dissipation.