System level signal and power integrity analysis methodology for system-in-package applications

  • Authors:
  • Rohan Mandrekar;Krishna Bharath;Krishna Srinivasan;Ege Engin;Madhavan Swaminathan

  • Affiliations:
  • Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA

  • Venue:
  • Proceedings of the 43rd annual Design Automation Conference
  • Year:
  • 2006

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Abstract

This paper describes a methodology for performing system level signal and power integrity analyses of SiP-based systems. The paper briefly outlines some new modeling and simulation techniques that have been developed to enable the proposed methodology. Some results based on the application of this methodology on test systems are also presented.