Computationally efficient power integrity simulation for system-on-package applications

Authors:
Krishna Bharath;Ege Engin;Madhavan Swaminathan;Kazuhide Uriu;Toru Yamada
Affiliations:
Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA;Matsushita Electric Industrial Co., Ltd.;Matsushita Electric Industrial Co., Ltd.
Venue:
Proceedings of the 44th annual Design Automation Conference
Year:
2007

Citing 1
Cited 1

System level signal and power integrity analysis methodology for system-in-package applications

Proceedings of the 43rd annual Design Automation Conference

Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM

Proceedings of the 45th annual Design Automation Conference

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Abstract

Power integrity simulation for system-on-package (SoP) based modules is a crucial bottleneck in the SoP design flow. In this paper, the multi-layer finite difference method (M-FDM) augmented with models for split planes has been proposed as a fast and accurate frequency domain engine. Results demonstrating the accuracy and scalability of the method have been presented. In particular, the algorithm was employed to the analysis of a realistic 6 layer package with ~ 200k nodes.