Power management using test-pattern ordering for wafer-level test during burn-in
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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Yield and reliability are two key factors affecting costs and profits in the semiconductor industry. Stress testing is a technique based on the application of higher than usual levels of stress to speed up the deterioration of electronic devices and increase yield and reliability. One of the standard industrial approaches for stress testing is high temperature burnin. This work proposes a full-scan circuit ATPG for dynamic burn-in. The goal of the proposed ATPG approach is to generate test patterns able to force transitions into each node of a full scan circuit to guarantee a uniform distribution of the stress during the dynamic burn-in test.