A novel approach to resistivity and interconnect modeling

Authors:
Y. Travaly;M. Bamal;L. Carbonell;F. Iacopi;M. Stucchi;M. Van Hove;G. P. Beyer
Affiliations:
IMEC vzw, 75 Kapeldreef, 3001 Heverlee, Belgium;IMEC vzw, 75 Kapeldreef, 3001 Heverlee, Belgium;IMEC vzw, 75 Kapeldreef, 3001 Heverlee, Belgium;IMEC vzw, 75 Kapeldreef, 3001 Heverlee, Belgium;IMEC vzw, 75 Kapeldreef, 3001 Heverlee, Belgium;IMEC vzw, 75 Kapeldreef, 3001 Heverlee, Belgium;IMEC vzw, 75 Kapeldreef, 3001 Heverlee, Belgium
Venue:
Microelectronic Engineering
Year:
2006

Citing 0
Cited 2

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Microelectronic Engineering
Accurate predictive interconnect modeling for system-level design

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Abstract

This paper describes a simple and novel approach to calculate the line resistance of copper interconnects. The proposed methodology is simply based on a linear representation of the Cu resistivity vs. 1/S"C"u (S"C"u is the Cu cross-sectional area) in which the slope captures the net result of scattering phenomena in Cu.