Micro-jet printing of polymers for electronics manufacturing

  • Authors:
  • D. J. Hayes;W. R. Cox

  • Affiliations:
  • MicroFab Technol. Inc., Plano, TX, USA;-

  • Venue:
  • ADHES '98 Proceedings of the Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. on Proceedings of 3rd international Conference
  • Year:
  • 1998

Quantified Score

Hi-index 0.00

Visualization

Abstract

Ink-jet/micro-jet printing methods are being developed for direct writing of a variety of materials for electronics and optoelectronics manufacturing. Advantages offered by this approach for micro-element fabrication and adhesive joining include precise volumetric control of dispensed material, data-driven flexibility, low cost, high speed and low environmental impact. Custom thermo-setting and thermoplastic systems have been developed for the printing of optical interconnects, dielectric elements and coatings, adhesives and thick film resistors, utilizing a drop-on-demand piezoelectric print head operable at temperatures up to 300/spl deg/C. Examples of printing reviewed here are: (a) adhesives for component bonding; (b) dielectrics for overcoating and conformal microelectronics fabrication; (c) thick-film resistors; (d) micro-optical components; and (e) polymers filled with oxides and fluorescent materials. Manufacturing applications potentially addressable to advantage by this method include flip-chip die attach, chip-scale microelectronics packaging, underfilling and overcoating, along with fabrication of passive devices, disk drive heads and flat panel displays.