3D Integration for Introspection

Authors:
Shashidhar Mysore;Banit Agrawal;Navin Srivastava;Sheng-Chih Lin;Kaustav Banerjee;Timothy Sherwood
Affiliations:
University of California, Santa Barbara;University of California, Santa Barbara;University of California, Santa Barbara;University of California, Santa Barbara;University of California, Santa Barbara;University of California, Santa Barbara
Venue:
IEEE Micro
Year:
2007

Citing 10
Cited 1

CCured: type-safe retrofitting of legacy code

POPL '02 Proceedings of the 29th ACM SIGPLAN-SIGACT symposium on Principles of programming languages
A Programmable Co-processor for Profiling

HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
Protecting C programs from attacks via invalid pointer dereferences

Proceedings of the 9th European software engineering conference held jointly with 11th ACM SIGSOFT international symposium on Foundations of software engineering
Secure program execution via dynamic information flow tracking

ASPLOS XI Proceedings of the 11th international conference on Architectural support for programming languages and operating systems
Minos: Control Data Attack Prevention Orthogonal to Memory Model

Proceedings of the 37th annual IEEE/ACM International Symposium on Microarchitecture
BugNet: Continuously Recording Program Execution for Deterministic Replay Debugging

Proceedings of the 32nd annual international symposium on Computer Architecture
Mondrix: memory isolation for linux using mondriaan memory protection

Proceedings of the twentieth ACM symposium on Operating systems principles
Demystifying 3D ICs: The Pros and Cons of Going Vertical

IEEE Design & Test
Introspective 3D chips

Proceedings of the 12th international conference on Architectural support for programming languages and operating systems
Die Stacking (3D) Microarchitecture

Proceedings of the 39th Annual IEEE/ACM International Symposium on Microarchitecture

A modular 3d processor for flexible product design and technology migration

Proceedings of the 5th conference on Computing frontiers

Quantified Score

Hi-index	0.00

Visualization

Abstract

In today's complex processors, specialized profiling and introspection hardware would be incredibly beneficial to software developers, but most proposals for its addition would increase the cost of every die manufactured. Modular, "snap-on" analysis hardware, stacked vertically with the processor die using a 3D interconnect, could be included with developer systems to assist in debugging and testing, and omitted from consumer systems to keep them economically competitive.