Reaching the limits of low power design
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Resilient dynamic power management under uncertainty
Proceedings of the conference on Design, automation and test in Europe
On-chip aging sensor circuits for reliable nanometer MOSFET digital circuits
IEEE Transactions on Circuits and Systems II: Express Briefs
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Semiconductor manufacturing technology faces ever-greater challenges of pitch, mobility, variability, leakage, and reliability. To enable cost-effective continuation of the semiconductor roadmap, there is greater need for design technology to provide "equivalent scaling", and for product-specific design innovation (multi-core architecture, software support, beyond-die integration, etc.) to provide "more than Moore" scaling. Design challenges along the road to 45nm include variability and power management, and leverage of design-manufacturing synergies. Potential solutions include "design for manufacturability" bridges between chip implementation and manufacturing know-how.