Efficient numerical modeling of random rough surface effects for interconnect internal impedance extraction

Authors:
Quan Chen;Ngai Wong
Affiliations:
The University of Hong Kong, Hong Kong;The University of Hong Kong, Hong Kong
Venue:
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Year:
2008

Citing 3
Cited 1

Efficient integral equation based algorithms for parasitic extraction of interconnects with smooth or rough surface

Efficient integral equation based algorithms for parasitic extraction of interconnects with smooth or rough surface
A stochastic integral equation method for modeling the rough surface effect on interconnect capacitance

Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
FastSies: a fast stochastic integral equation solver for modeling the rough surface effect

ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design

Robust simulation methodology for surface-roughness loss in interconnect and package modelings

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

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Abstract

This paper proposes an efficient model for numerically evaluating the impact of random surface roughness on the internal impedance for large-scale interconnect structures. The effective resistivity (ER) and effective permeability (EP) are numerically formulated to avoid the computationally prohibitive global discretization, while maintaining the model accuracy and flexibility. A modified stochastic integral equation (SIE) method is proposed to significantly speed up the computation for the mean values of ER and EP under the assumption of random surface roughness. Numerical experiments then verify the efficacy of our approach.