High performance RF-microwave multilayer integrated components for wireless applications

Authors:
Yasar Amin;Hannu Tenhunen;Habibullah Jamal;Li-Rong Zheng;Xinzhong Duo
Affiliations:
Royal Institute of Technology, Stockholm, Sweden and University of Engineering and Technology Taxila, Pakistan;Royal Institute of Technology, Stockholm, Sweden and University of Engineering and Technology Taxila, Pakistan;Royal Institute of Technology, Stockholm, Sweden and University of Engineering and Technology Taxila, Pakistan;Royal Institute of Technology, Stockholm, Sweden and University of Engineering and Technology Taxila, Pakistan;Royal Institute of Technology, Stockholm, Sweden and University of Engineering and Technology Taxila, Pakistan
Venue:
EHAC'05 Proceedings of the 4th WSEAS International Conference on Electronics, Hardware, Wireless and Optical Communications
Year:
2005

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Abstract

Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5GHz require low power and high quality integrated transceiver solutions. The integration of RF front-end especially poses a great challenge to these applications as traditional system on chip (SOC) approach is quite inefficient. A system on package approach can address the problems in an optimum way. In this paper we present a comparison of different passive element fabrication choices. These passives are to be fabricated between different modules on an MCM-D substrate. Inductors and capacitors are compared on the bases of their Q-factors and SRF (self resonance frequency). RF receiver module for 5GHz wireless LAN applications is implemented using benzocyclobutene (BCB) as interlayer material.