High Speed I./O Buffer for MCM
MCMC '97 Proceedings of the 1997 Conference on IEEE Multi-Chip Module Conference
The Impact of Miniaturization and Passive Component Integration in Emerging MCM Applications
MCMC '97 Proceedings of the 1997 Conference on IEEE Multi-Chip Module Conference
The Application of Silicon-on-Silicon MCMs to Advanced Analog Power Controllers
MCMC '96 Proceedings of the 1996 IEEE Multi-Chip Module Conference (MCMC '96)
Design and Analysis of Area-IO DRAM/Logic Integration with System-in-a-Package(SiP)
ISQED '05 Proceedings of the 6th International Symposium on Quality of Electronic Design
Area-IO DRAM/logic integration with system-in-a-package (SiP)
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
Substrate Testing on a Multi-Site/Multi-Probe ATE
Journal of Electronic Testing: Theory and Applications
High performance RF-microwave multilayer integrated components for wireless applications
EHAC'05 Proceedings of the 4th WSEAS International Conference on Electronics, Hardware, Wireless and Optical Communications
Thermal-aware memory mapping in 3D designs
Proceedings of the Conference on Design, Automation and Test in Europe
Bus-switch coding for reducing power dissipation in off-chip buses
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Thermal-aware memory mapping in 3D designs
ACM Transactions on Embedded Computing Systems (TECS)
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