MediaBench: a tool for evaluating and synthesizing multimedia and communicatons systems
MICRO 30 Proceedings of the 30th annual ACM/IEEE international symposium on Microarchitecture
A low power unified cache architecture providing power and performance flexibility (poster session)
ISLPED '00 Proceedings of the 2000 international symposium on Low power electronics and design
System-in-package (SIP): challenges and opportunities
ASP-DAC '00 Proceedings of the 2000 Asia and South Pacific Design Automation Conference
Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology
ASP-DAC '00 Proceedings of the 2000 Asia and South Pacific Design Automation Conference
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
HPCA '02 Proceedings of the 8th International Symposium on High-Performance Computer Architecture
Performance, Energy, and Thermal Considerations for SMT and CMP Architectures
HPCA '05 Proceedings of the 11th International Symposium on High-Performance Computer Architecture
Three-Dimensional Cache Design Exploration Using 3DCacti
ICCD '05 Proceedings of the 2005 International Conference on Computer Design
Thermal analysis of a 3D die-stacked high-performance microprocessor
GLSVLSI '06 Proceedings of the 16th ACM Great Lakes symposium on VLSI
Compiler-directed thermal management for VLIW functional units
Proceedings of the 2006 ACM SIGPLAN/SIGBED conference on Language, compilers, and tool support for embedded systems
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DRAM is usually used as main memory for program execution. The thermal behavior of a memory block in a 3D SIP is affected not only by the power behavior but also the heat dissipating ability of that block. The power behavior of a block is related to the applications run on the system while the heat dissipating ability is determined by the number of tier and the position the block locates. Therefore, a thermal-aware memory allocator should consider the following two points. First, allocator should consider not only the power behavior of a memory block but also the physical location during memory mapping, second, the changing temperature of a physical block during execution of programs. In this paper, we will propose a memory mapping algorithm taking into consideration the above-mentioned two points. Our technique can be classified as static thermal management to be applied to embedded software designs. Experiments show that our method can reduce temperature of memory system by 17.2°C as compared to a straightforward mapping in the best case, and 13.4°C in average.