System-in-package (SIP): challenges and opportunities
ASP-DAC '00 Proceedings of the 2000 Asia and South Pacific Design Automation Conference
Proceedings of the 2001 Asia and South Pacific Design Automation Conference
DRAM Circuit Design: A Tutorial
DRAM Circuit Design: A Tutorial
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This paper presents a cost-effective area-IO DRAM (aDRAM)/Logic integration implemented with CLC (Chip-Laminate-Chip)-based System-in-a-Package (SiP) technology. By inserting 512 area-IOs into the aDRAM, the bandwidth of the area-IO DRAM can achieve 10GB/s when working under 166MHz. An interface module with configurable IO width was also developed to make this implementation platform adoptable by various applications. A performance analysis, including bandwidth and power is also presented in this paper. It is demonstrated that area-IO DRAM/Logic integration with SiP technology provides a significant cost-effective implementation methodology compared with embedded DRAM and off-chip DRAM.