Pre-bond testable low-power clock tree design for 3D stacked ICs
Proceedings of the 2009 International Conference on Computer-Aided Design
Clock tree synthesis with pre-bond testability for 3D stacked IC designs
Proceedings of the 47th Design Automation Conference
Cost-effective integration of three-dimensional (3D) ICs emphasizing testing cost analysis
Proceedings of the International Conference on Computer-Aided Design
A DfT Architecture for 3D-SICs Based on a Standardizable Die Wrapper
Journal of Electronic Testing: Theory and Applications
Three-dimensional Integrated Circuits: Design, EDA, and Architecture
Foundations and Trends in Electronic Design Automation
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3D integration is an emerging technology that allows for the vertical stacking of multiple silicon die. These stacked die are tightly integrated with through-silicon vias and promise significant power and area reductions by replacing long global wires with short vertical connections. This technology necessitates that neighboring logical blocks exist on different layers in the stack. However, such functional partitions disable intra-chip communication pre-bond and thus disrupt traditional test techniques.Previous work has described a general test architecture that enables pre-bond testability of an architecturally partitioned 3D processor and provided mechanisms for basic layer functionality. This work proposes new test methods for designs partitioned at the circuits level,in which the gates and transistors of individual circuits could be split across multiple die layers. We investigated a bit-partitioned adder unit and a port-split register file, which represents the most difficult circuit-partitioned design to test pre-bond but which is used widely in many circuits. Two layouts of each circuit, planar and 3D, are produced. Our experiments verify the performance and power results and examine the test coverage achieved.