Bidwidth analysis with application to silicon compilation
PLDI '00 Proceedings of the ACM SIGPLAN 2000 conference on Programming language design and implementation
Predictive dynamic thermal management for multimedia applications
ICS '03 Proceedings of the 17th annual international conference on Supercomputing
HW-SW emulation framework for temperature-aware design in MPSoCs
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Temperature-Aware Compilation for VLIWProcessors
RTCSA '07 Proceedings of the 13th IEEE International Conference on Embedded and Real-Time Computing Systems and Applications
Reliability-aware design for nanometer-scale devices
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Compiler-driven register re-assignment for register file power-density and temperature reduction
Proceedings of the 45th annual Design Automation Conference
Engineering A Compiler
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This paper suggests that the thermal state of a processor can be approximated using data flow analysis. The results of this analysis can be used to evaluate the efficacy of thermal-aware compilation strategies, or as input to thermal-aware optimizations that occur in the early stages of back-end compilation. We propose different ways how the exploitation of thermal behavior knowledge can be included in the different compilation phases.