Thermal Testing on Reconfigurable Computers
IEEE Design & Test
StepNP: A System-Level Exploration Platform for Network Processors
IEEE Design & Test
Partition-driven standard cell thermal placement
Proceedings of the 2003 international symposium on Physical design
Predictive dynamic thermal management for multimedia applications
ICS '03 Proceedings of the 17th annual international conference on Supercomputing
Full chip leakage estimation considering power supply and temperature variations
Proceedings of the 2003 international symposium on Low power electronics and design
Reducing power density through activity migration
Proceedings of the 2003 international symposium on Low power electronics and design
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
HPCA '02 Proceedings of the 8th International Symposium on High-Performance Computer Architecture
×pipesCompiler: A Tool for Instantiating Application Specific Networks on Chip
Proceedings of the conference on Design, automation and test in Europe - Volume 2
Temperature-aware microarchitecture: Modeling and implementation
ACM Transactions on Architecture and Code Optimization (TACO)
Proceedings of the 41st annual Design Automation Conference
Processor/Memory Co-Exploration on Multiple Abstraction Levels
DATE '03 Proceedings of the conference on Design, Automation and Test in Europe - Volume 1
Thermal via placement in 3D ICs
Proceedings of the 2005 international symposium on Physical design
MPARM: Exploring the Multi-Processor SoC Design Space with SystemC
Journal of VLSI Signal Processing Systems
Exploring "temperature-aware" design in low-power MPSoCs
Proceedings of the conference on Design, automation and test in Europe: Proceedings
A matrix synthesis approach to thermal placement
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Reliability-aware design for nanometer-scale devices
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Thermal-aware data flow analysis
Proceedings of the 46th Annual Design Automation Conference
Design and performance evaluation of virtual-channel based NoC
ASID'09 Proceedings of the 3rd international conference on Anti-Counterfeiting, security, and identification in communication
Prototype design of cluster-based homogeneous multiprocessor system-on-chip
ASID'09 Proceedings of the 3rd international conference on Anti-Counterfeiting, security, and identification in communication
Thermal balancing policy for multiprocessor stream computing platforms
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Concept-based partitioning for large multidomain multifunctional embedded systems
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Thermal-aware floorplanning exploration for 3D multi-core architectures
Proceedings of the 20th symposium on Great lakes symposium on VLSI
Thermal-aware compilation for system-on-chip processing architectures
Proceedings of the 20th symposium on Great lakes symposium on VLSI
An integrated thermal estimation framework for industrial embedded platforms
Proceedings of the 20th symposium on Great lakes symposium on VLSI
Hardware-assisted dynamic power and thermal management in multi-core SoCs
Proceedings of the 21st edition of the great lakes symposium on Great lakes symposium on VLSI
Thermal-aware system analysis and software synthesis for embedded multi-processors
Proceedings of the 48th Design Automation Conference
Online thermal control methods for multiprocessor systems
ACM Transactions on Design Automation of Electronic Systems (TODAES) - Special section on adaptive power management for energy and temperature-aware computing systems
Predictability for timing and temperature in multiprocessor system-on-chip platforms
ACM Transactions on Embedded Computing Systems (TECS) - Special section on ESTIMedia'12, LCTES'11, rigorous embedded systems design, and multiprocessor system-on-chip for cyber-physical systems
Dynamic Power and Thermal Management of NoC-Based Heterogeneous MPSoCs
ACM Transactions on Reconfigurable Technology and Systems (TRETS)
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New tendencies envisage multiprocessor systems-on-chips (MPSoCs) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute multiple applications (games, video) while meeting additional design constraints (energy consumption, time-to-market). Moreover, the rise of temperature in the die for MPSoCs can seriously affect their final performance and reliability. In this article, we present a new hardware-software emulation framework that allows designers a complete exploration of the thermal behavior of final MPSoC designs early in the design flow. The proposed framework uses FPGA emulation as the key element to model hardware components of the considered MPSoC platform at multimegahertz speeds. It automatically extracts detailed system statistics that are used as input to our software thermal library running in a host computer. This library calculates at runtime the temperature of on-chip components, based on the collected statistics from the emulated system and final floorplan of the MPSoC. This enables fast testing of various thermal management techniques. Our results show speedups of three orders of magnitude compared to cycle-accurate MPSoC simulators.