Opportunities and Challenges for 3D Systems and Their Design

  • Authors:
  • Philip Emma;Eren Kursun

  • Affiliations:
  • IBM Research;IBM Research

  • Venue:
  • IEEE Design & Test
  • Year:
  • 2009

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Abstract

Editor's note:This article presents the system design opportunities offered by 3D integration, and it discusses the design and test challenges for 3D ICs, with various new design-for-manufacture and DFT issues.—Yuan Xie, Pennsylvania State University