Power-efficient, reliable microprocessor architectures: modeling and design methods

  • Authors:
  • Pradip Bose;Alper Buyuktosunoglu;Chen-Yong Cher;John A. Darringer;Meeta S. Gupta;Hendrik Hamann;Hans Jacobson;Prabhakar N. Kudva;Eren Kursun;Niti Madan;Indira Nair;Jude A. Rivers;Jeonghee Shin;Alan J. Weger;Victor Zyuban

  • Affiliations:
  • IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA;IBM Corporation, Yorktown Heights, NY, USA

  • Venue:
  • Proceedings of the 20th symposium on Great lakes symposium on VLSI
  • Year:
  • 2010

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Abstract

Next generation system designs are challenged by multiple "walls": among them, the inter-related impediments offered by power dissipation limits and reliability are particularly difficult ones that all current chip/system design teams are grappling with. In this paper, we first describe the attendant challenges in integrated (multi-dimensional) pre-silicon modeling and the solution approaches being pursued. Later, we focus on leading edge solutions for power, thermal and failure-rate mitigation that have been proposed in our R&D work over the past decade.