Fundamentals of modern VLSI devices
Fundamentals of modern VLSI devices
Temperature effect on delay for low voltage applications
Proceedings of the conference on Design, automation and test in Europe
Proceedings of the 39th annual Design Automation Conference
Full chip leakage estimation considering power supply and temperature variations
Proceedings of the 2003 international symposium on Low power electronics and design
System level leakage reduction considering the interdependence of temperature and leakage
Proceedings of the 41st annual Design Automation Conference
Practical repeater insertion for low power: what repeater library do we need?
Proceedings of the 41st annual Design Automation Conference
ISLPED '05 Proceedings of the 2005 international symposium on Low power electronics and design
The need for a full-chip and package thermal model for thermally optimized IC designs
ISLPED '05 Proceedings of the 2005 international symposium on Low power electronics and design
A global wiring paradigm for deep submicron design
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Supply and power optimization in leakage-dominant technologies
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Task activity vectors: a new metric for temperature-aware scheduling
Proceedings of the 3rd ACM SIGOPS/EuroSys European Conference on Computer Systems 2008
Temperature-aware MPSoC scheduling for reducing hot spots and gradients
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Full-system chip multiprocessor power evaluations using FPGA-based emulation
Proceedings of the 13th international symposium on Low power electronics and design
Algorithms for Temperature-Aware Task Scheduling in Microprocessor Systems
AAIM '08 Proceedings of the 4th international conference on Algorithmic Aspects in Information and Management
Predict and act: dynamic thermal management for multi-core processors
Proceedings of the 14th ACM/IEEE international symposium on Low power electronics and design
A Fast Scheme to Investigate Thermal-Aware Scheduling Policy for Multicore Processors
APPT '09 Proceedings of the 8th International Symposium on Advanced Parallel Processing Technologies
Accurate temperature estimation using noisy thermal sensors
Proceedings of the 46th Annual Design Automation Conference
Dynamic thermal management via architectural adaptation
Proceedings of the 46th Annual Design Automation Conference
Thermal analysis of multiprocessor SoC applications by simulation and verification
ACM Transactions on Design Automation of Electronic Systems (TODAES)
A cost-effective load-balancing policy for tile-based, massive multi-core packet processors
ACM Transactions on Embedded Computing Systems (TECS)
Multicore power management: ensuring robustness via early-stage formal verification
MEMOCODE'09 Proceedings of the 7th IEEE/ACM international conference on Formal Methods and Models for Codesign
Performance-aware thermal management via task scheduling
ACM Transactions on Architecture and Code Optimization (TACO)
On-chip sensor-driven efficient thermal profile estimation algorithms
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Software adaptation in quality sensitive applications to deal with hardware variability
Proceedings of the 20th symposium on Great lakes symposium on VLSI
Power-efficient, reliable microprocessor architectures: modeling and design methods
Proceedings of the 20th symposium on Great lakes symposium on VLSI
Performance and energy efficient cache migrationapproach for thermal management in embedded systems
Proceedings of the 20th symposium on Great lakes symposium on VLSI
Efficient calibration of thermal models based on application behavior
ICCD'09 Proceedings of the 2009 IEEE international conference on Computer design
Power and thermal characterization of POWER6 system
Proceedings of the 19th international conference on Parallel architectures and compilation techniques
Hybrid dynamic energy and thermal management in heterogeneous embedded multiprocessor SoCs
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
Cool and save: cooling aware dynamic workload scheduling in multi-socket CPU systems
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
A case for opportunistic embedded sensing in presence of hardware power variability
HotPower'10 Proceedings of the 2010 international conference on Power aware computing and systems
Exploring the effects of on-chip thermal variation on high-performance multicore architectures
ACM Transactions on Architecture and Code Optimization (TACO)
Curbing energy cravings in networks: a cross-sectional view across the micro-macro boundary
NOCS '11 Proceedings of the Fifth ACM/IEEE International Symposium on Networks-on-Chip
Dimetrodon: processor-level preventive thermal management via idle cycle injection
Proceedings of the 48th Design Automation Conference
Predictive Model-Based Thermal Management for Network Applications
Proceedings of the 2011 ACM/IEEE Seventh Symposium on Architectures for Networking and Communications Systems
Maestro: orchestrating lifetime reliability in chip multiprocessors
HiPEAC'10 Proceedings of the 5th international conference on High Performance Embedded Architectures and Compilers
Recent thermal management techniques for microprocessors
ACM Computing Surveys (CSUR)
Proceedings of the 49th Annual Design Automation Conference
Fan-speed-aware scheduling of data intensive jobs
Proceedings of the 2012 ACM/IEEE international symposium on Low power electronics and design
Multi-level simultaneous multithreading scheduling to reduce the temperature of register files
Concurrency and Computation: Practice & Experience
ACM Transactions on Architecture and Code Optimization (TACO)
Cooperative boosting: needy versus greedy power management
Proceedings of the 40th Annual International Symposium on Computer Architecture
Temperature aware thread block scheduling in GPGPUs
Proceedings of the 50th Annual Design Automation Conference
A multi-agent framework for thermal aware task migration in many-core systems
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
AppAdapt: opportunistic application adaptation in presence of hardware variation
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Thermal-constrained task allocation for interconnect energy reduction in 3-D homogeneous MPSoCs
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
CoMETC: Coordinated management of energy/thermal/cooling in servers
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Correcting vibration-induced performance degradation in enterprise servers
ACM SIGMETRICS Performance Evaluation Review
Hi-index | 0.00 |
Power-related issues have become important considerations in current generation microprocessor design. One of these issues is that of elevated on-chip temperatures. This has an adverse effect on cooling cost and, if not addressed suitably, on chip reliability. In this paper we investigate the general trade-offs between temporal and spatial hot spot mitigation schemes and thermal time constants, workload variations and microprocessor power distributions. By leveraging spatial and temporal heat slacks, our schemes enable lowering of on-chip unit temperatures by changing the workload in a timely manner with Operating System(OS) and existing hardware support.