An electromagnetic approach for modeling high performance computer packages
IBM Journal of Research and Development
Improved performance of IBM Enterprise System/9000 bipolar logic chips
IBM Journal of Research and Development
IBM Journal of Research and Development
Equipment-related advances in the fabrication of glass-ceramic/copper/polymide substrates
IBM Journal of Research and Development
IBM Journal of Research and Development
Layer assignment for high-performance multi-chip modules
ICCAD '94 Proceedings of the 1994 IEEE/ACM international conference on Computer-aided design
MCM technology and design for the S/390 G5 system
IBM Journal of Research and Development
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