Physical and electrical design features of the IBM Enterprise System/9000 circuit module
IBM Journal of Research and Development
Optimization of interconnections between packaging levels
IBM Journal of Research and Development
Physical and electrical design features of the IBM Enterprise System/9000 circuit module
IBM Journal of Research and Development
Equipment-related advances in the fabrication of glass-ceramic/copper/polymide substrates
IBM Journal of Research and Development
An advanced multichip module (MCM) for high-performance UNIX servers
IBM Journal of Research and Development
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