An advanced multichip module (MCM) for high-performance UNIX servers

  • Authors:

  • J. U. Knickerbocker;F. L. Pompeo;A. F. Tai;D. L. Thomas;R. D. Weekly;M. G. Nealon;H. C. Hamel;A. Haridass;J. N. Humenik;R. A. Shelleman;S. N. Reddy;K. M. Prettyman;B. V. Fasano;S. K. Ray;T. E. Lombardi;K. C. Marston;P. A. Coico;P. J. Brofman;L. S. Goldmann;D. L. Edwards;J. A. Zitz;S. Iruvanti;S. L. Shinde;H. P. Longworth

  • Affiliations:

  • IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533

  • Venue:
  • IBM Journal of Research and Development
  • Year:
  • 2002

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Abstract

In 2001, IBM delivered to the marketplace a high-performance UNIX脗®-class eServer based on a four-chip multichip module (MCM) code named Regatta. This MCM supports four POWER4 chips, each with 170 million transistors, which utilize the IBM advanced copper back-end interconnect technology. Each chip is attached to the MCM through 7018 flip-chip solder connections. The MCM, fabricated using the IBM high-performance glass-ceramic technology, features 1.7 million internal copper vias and high-density top-surface contact pad arrays with 100-脗µm pads on 200-脗µm centers. Interconnections between chips on the MCM and interconnections to the board for power distribution and MCM-to-MCM communication are provided by 190 meters of co-sintered copper wiring. Additionally, the 5100 off-module connections on the bottom side of the MCM are fabricated at a 1-mm pitch and connected to the board through the use of a novel land grid array technology, thus enabling a compact 85-mm 脙聴 85-mm module footprint that enables 8- to 32-way systems with processors operating at 1.1 GHz or 1.3 GHz. The MCM also incorporates advanced thermal solutions that enable 156 W of cooling per chip. This paper presents a detailed overview of the fabrication, assembly, testing, and reliability qualification of this advanced MCM technology.